Glass substrates, with their advantages of high insulation, excellent thermal stability and low dielectric loss, have become critical for supporting the packaging of next-generation high-computing-power chips. Through-Glass Via (TGV) technology, as the core technology for glass substrates to realize high-density three-dimensional interconnection, provides a new solution for chip packaging, and can effectively meet the needs of high-performance chips for high frequency, high speed, low loss and large-size high-density integration. This book systematically organizes a full-chain knowledge system of through-glass via technology, ranging from basic materials to packaging applications.

YU Daquan serves as a Professor and Supervisor of Doctoral Candidates at the Institute of Microelectronics, Chinese Academy of Sciences from 2010 to 2015; he has been the CTO and President of the Packaging Technology Research Institute of Tianshui Huatian Technology Group since 2014, was selected as a Minjiang Scholar Distinguished Professor in December 2018, and founded Xiamen Yuntian Technology Co., Ltd. in 2018, where he currently serves as the Chairman and General Manager of Yuntian Semiconductor.